| Technical specifications BOWA DP S65 | |
| SHREDDING MATERIAL | |
| Shreddable material * | Sim, Ram Semiconductor, SD-MicroSD, Chip |
| SHREDDING SIZE AND SECURITY LEVEL | |
| Shredding size | < 0,1 - 2x2 - 3x3 mm |
| Security Level (DIN 66399) | E-6 E-7 |
| PERFORMANCE | |
| Shredding capacity | 1-2 Pcs |
| Throughput per hour | 400 – 600 Pcs/ h 12-20 kg |
| Insertion width | 240 x 10 mm |
| Bin capacity | 25 L |
| HARDWARE | |
| Power / Voltage / frequency | 6,5 kw/380V/ 50 Hz |
| Machine size | W1180xD720xH1255 mm |
| Machine weight | 458 kg |
| Noise level | 70 dB |
| Warranty | 12 months |